Basic-Die-Bond-Process.ppt
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Basic-Die-Bond-Process.ppt
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BasicDieBondProcess,TableofContent,IntroductionTypicalDieBondingSequenceDispensingDiePickingDieBonding,Introduction,BasicDieBondProcess:
Toattachthediestothepadsonthesubstrates,Introduction,CommonDieBondProcessesEpoxydiebondingEutecticdiebondingSoftsolderdiebonding,TypicalDieBondSequence,Step1:
Dispensing,Step2:
DiePicking,Step3:
DieBonding,Step1:
StackLoader,Substrate,CommonlyusedsubstratesPCBLeadframeBGACeramic,Wafer,Differenttypeofwaferring/frame/wafercassetteWafercassetteDiscoK&SWaferringDiscoK&STeflon,Dcompany,Kcompany,DifferenttypeofwafertapematerialMylartapeUVtapeWafflepack,BlueMylarTape,ColorlessUVTape,Wafer,FactorsdeterminethedegreeofuniformityofwafertapeDiesizeLargediesizehaveabettertackinessSurfacefinishofthewaferbackSmoothsurfaceofwaferbackhavehighertackinessDurationofdieadhesiontowafertapeThelongerthedieareonthetape,themoretheyadhere,Wafer,FactorsdeterminethedegreeofuniformityofwafertapeExposuretoUVlightThelongertheexposuretoUVlight,thelesstheyadhereStorageconditionItshouldbestoredinamoderateconditiontemp:
10-25Chumidity:
60-70%TapemountingprocessamountoftensionshouldbeeveninbothX&Ydirection,Wafer,Dispensing,Time-Pressure-VacuumVolumetricStamping(RotatingDisc),Tool:
-Epoxywriting-ShowerHead,Tool:
-StampingPin,Dispensing,Dispensing,BackgroundInformation-EpoxyFunctionofepoxyAdheresthedieonsubstrateCommonly-usedepoxyTypicalProperty,Time-Pressure-VacuumSystemAprocessoftheapplicationofcompressedairinapresetperiodforthefluiddispensingApplyVacuumforremovingthecompressedairMaintainthepressurePreventdripping&suckback,DispensingMethodTime-Pressure-Vacuum,Syringewithepoxy,Vacuum,Pressure,DrawBacksDispensingvolumeepoxyviscositySyringeInternalpressureepoxylevelAirvolumeinsidethesyringechangesfordifferentepoxylevelResponsetimefor“vacuum-suction”and“air-compression”isthuschangingwithepoxylevelIfthevacuumlevelisnotadjustedproperly,“epoxydripping”&“sucking-inofairbubbles”mayoccureasily.,DispensingMethodTime-Pressure-Vacuum,Time-Pressure-dispenser(fromMusashi)Musashidispensingsystemcancompensateepoxylevelchangeinsyringebyreal-timemonitoringontheactualpressureresponseNeedtopreparea“full”syringeandanempty”syringeinordertoteachthedispenserhowtocompensateTheTP-dispenserwillthenadjustthe“dispensingtime”&“vacuumlevel”accordinglytocompensateforanychangeinsyringeepoxylevelUsercanset“epoxylevelalarm”toavoidrunningoutofepoxyduringproductionrun,DispensingMethodTime-Pressure-Vacuum,DispensingMethodTime-Pressure-Vacuum,Musashi,Connecttosyringe,VolumetricDispensingProcessPrinciplePositiveDisplacementSystem(PistonPump)ApplycompressedairPullupthepistontofeedepoxyintothechamberSwitchthevalveportPistonispushedtodispenseepoxy,DispensingMethod-Volumetric,Valve,2-positive-displacementpumpsdispensingCycle,Dispensingfinishesatleftchamberandrightchamberisfilled,Leftchamberisfilledupandrightchamberfinishesdispensing,Valveswitches,DispensingMethod-Volumetric,Valveswitches,Switchingvalve,Pumpbody,Partstobewashed,DispensingMethod-Volumetric,DispensingMethodology,VolumetricDispensingAdvantagesTruepositivedisplacementdispensingNodrippingInconsistencycomesfrompistonpositionerrorandepoxycompressibilityonlyHighaccuracyDrawBacksSlowepoxyfeed-inrateComplicateddesignandlongertime&costlymaintenance,DispensingTool-Writing,Dispenser,L/F,AnvilBlock,Epoxy,DispensingTool-Writing,AprocesstodispensetheepoxyontotheleadframewithprogrammabletrajectorytodrawadispensingpatternaccordingtothegivendiesizeAdoptedtowiderangeofdiesize:
60x601000x1000mils,DispenserX,Y,ZMotion,DispensingTool-Writing,AdvantagesFlexiblefordifferencediesizeEasytocontrolepoxycoverageEasytocontroldietiltandBLTToolsDrawbacksSlowwriting,maydecreaseUPH,DispensingTool-Writing,DispensingTool-Writing,DispensingTool-Writing,L/F,Pad,DispensingToolShowerHead,ShowerHeadDispensingAprocessfordispensingtheepoxyontotheleadframewithafixeddispensingpatternofepoxydotsspeciallydesignedforaparticularrangeofdiesizePractical/applicablerangeofdiesizeforshowerheaddispensing:
30x30150x150mils,DispenserYandZMotion,DispensingToolShowerHead,Advantage:
IncreasingUPHforsmalltomedium-sizediebondingprocessDrawback:
Difficulttoset-uptogetaconsistentresultsforallpadsNozzleholesblockage,DispensedSamples,DispensingToolShowerHead,DispensingMethod-Stamping,AprocessfordispensingtheepoxyontotheleadframewithadispensedepoxydotaccordingtothestampingpinsizeTypicalrangeofdiesizefortheusageofepoxystamping:
7x720x20mils,DispensingToolStampingPin,Tiplength,Tipradius,Stampingpintip,DispensingMethod-Stamping,AdvantagesSmallepoxydotsizeHighspeedstampingAbletoachieveconsistentvolumeDrawbacksNeedprocesscontroltoavoidtailingDifficulttohandlelowviscosityadhesive,EffectofusageofDispensingMethod,CommonproblemsDrippingPre-SqueezeDelayPost-SqueezeDelayTailingInconsistencyVoid,PhototakenbyX-ray,Dispensing,Advantagesofdifferentdispensingmethod,Disadvantagesofdifferentdispensingmethod,DiePicking,DiePicking,Mylar,Collet,Wafer,EjectorCap,EjectorPin,DiePicking,DiePicking,EjectingToolsEjectorPinEjectorChuck(Pinholder)EjectorCapPickingToolsCollet,EjectingTool,PinEjectthediefromtheMylarChuckHoldingthepinCapActasplatformforholdingthedieHolesforvacuum,EjectorAssembly,Ejectorpin,EjectingToolEjectorPin,Ejectorpin,Ejectorpin-sharptype,Ejectorpintip,Enlargedviewofejectorpintip(sharptype),EjectingToolEjectorPin,Ejectorpin-roundtype,Enlargedviewofejectorpin(roundtype),EjectingToolEjectorPin,EjectorPinNotationEjectorpinisnotatedbythedimensionofpintipradiusExamplesR1ejectorpinTipradius=0.022mm=1milR5ejectorpin(roundpin)tipradius=0.125mm=5milsR3ejectorpintipradius=0.075mm=3milsR8ejectorpintipradius=0.200mm=8milsR10ejectorpinTipradius=0.300mm=10mil,EjectingToolEjectorPin,EjectorPinSelection
(1)MaterialTungstenCarbidePlasticTopreventdiebreakingToavoidpinmarkEjectorPinSelection
(2)forSmallDieDiesize(40mils)SharpPinPreventpickfailure,EjectingToolEjectorPin,EjectorPinSelection(3)forLargeDie/LongDieUseroundpin(40mils)MultiplepinsareusedAvoidstressconcentrationPreventdiecracking,EjectingToolEjectorPin,EjectorPinSelection(4)forThinDieMultiplesharppinsorCrownpinisusedforejectingthindieAvoidstressconcentrationPreventdiecrackingBrushingisalsoanothermethod,EjectingToolEjectorPin,EjectorPinSelection(5)EjectingtoolselectiontableBasedondiedimension,EjectingToolEjectorPin,Definitionofdiedimension,Schematicdiagramofchuck,EjectingToolEjectorPin,Multi-PinEjectorpinchuck/pinholder,EjectingToolEjectorChuck,Ejectorpinchuck/pinholder,Ejectorchuckhole,EjectingToolEjectorChuck,Ejectorcap,ThinDieCap,Multi-pinejectorcap,Pre-peelingcapforthindie,EjectingToolEjectorCap,Ejectorcap,Ejectorcaphole,EjectingToolEjectorCap,PickingTool,BondArmColletBodyCollet,PV2BondArm(AD898),ColletBody,Collet,Pick-uptools-ColletIncontactwithdiesurface;applyvacuumandpickupdiefromMylarSelectiondependsondiefeaturese.g.size,adhesionmethod,PickingTool-Collet,ColletBody,PickingTool-Collet,DifferentconfigurationofcolletRubbercolletroundtype&rectangulartype,Roundtype,Rectangulartype,PickingTool-Collet,Differentconfigurationofcollet2-sided&4-sidedcollet,Non-contactdiesurface(imagesensorapplication)SelfdiealignmentConsistentPick-position,PickingTool-Collet,Differentconfigurationofcollet4-sidedcollet,Non-contactdiesurfaceSelfdiealignmentConsistentPick-position,PickingTool-Collet,DifferentconfigurationofcolletHi-tempcollet,PickingTool-Collet,DifferentconfigurationofcolletTungstencarbidecollet,PickingTool-Collet,DifferentconfigurationofcolletThinDieColletForthindieapplication,normaldiecolletcenterhadabighole,duringsuckingitmaycrackthedieorcausingvoidinbothlaminatedtapebondingColletisflatsurfaceandonlysmallvacuumholestoreducevoidduringpickupandbonding,PickingTool-Collet,DifferentconfigurationofcolletRubbercolletcommonly-used,fornormaldiebonding2-sided&4sidedcolletfordiewithaspecialsurfacecoatingeliminatethepossiblecontaminationbythecontactbetweendieandcolletHi-tempcolletforeutecticbondingabletosustainthehightemperatureofleadframeTungstencarbidecolletforsmalldiebonding(sizerange20milsbelow)aimtopreventthesuck-backphenomenonafterbondinglongerlifetimeFlatColletToavoidvoidcomingoutforthindiebonding(fortapeapplication),PickingTool-Collet,DieBonding,DieBonding,Collet,L/F,AnvilBlock,Epoxy,Die,DieBonding,BondarmComparisonAnvilBlockDesign,BondarmComparison,RotaryBondarmformirrordieapplicationStandardinAD8912forcolletcompensationinsteadofheavytablecompensationintroducevibrationWeight326g(3timesheavierthanPF2)Normallyforbigdieapplication300mil,PV2bondarmStandardbondarmwithoutrotaryLighterweight95gforhighspeedwithlessvibrationNormallyforsmalldie100milinAD898,AD898/AD8912,PF2bondarmwithvoicecoilLighterforhi-speedapplication(95g)Movingpayload15g,BondarmComparison,AD828,90degreerotarybondarm,BondarmComparison,AD8930,AnvilBlockDesign,DispensingAnvilBlockBondAnvilBlockSomeequipwithvacuumholesforbetterholdingofthesubstrate,AnvilBlockDesign,DispensingAnvilBlockBondAnvilBlockSomeequippedwithvacuumholesforbetterholdingofthesubstrate,AnvilBlockDesign,MajorParametersondesigninganv
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- Basic Die Bond Process