电感国际测试规范.docx
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电感国际测试规范.docx
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电感国际测试规范
RELIABILITYTESTCONDITIONS
WIREWOUNDCHIPINDUCTORSTYPE
FORSMD322522/453232/SMTSDR322520/453226/SMDCHGR0603/0805/1008/1210/SMDFSR1008/SMT
Item(项目)
RequiredCharacteristics(要求)
TestMethod/Condition(测试方法)
1.Nocasedeformationor
Temperature:
85±CTime:
96±hours
changeinappearance.
Testednotlessthan1hour,normorethan2
2.△L/臣10%
HightemperatureStoragetest
Referencedocuments:
MIL-STD-202GMethod108A
高温储存试验
LowtemperatureStoragetest
Referencedocuments:
IEC68-2-1A6.16.2
低温储存试验
HumiditytestReference
documents:
MIL-STD-202G
Method103B
湿度测试
3.△Q/Qi30%
4.△DCR/DCR三10%
1.无明显的外观缺陷
2.感值变化不超过10%
3.质量因子变化不超过30%
4.直流电阻变化不超过10%
1.Nocasedeformationorchange
inappearance.
2.△L/i10%
3.△Q/Qi30%
4.△DCR/DCRi10%
1.无明显的外观缺陷
2.感值变化不超过10%
3.质量因子变化不超过30%
4.直流电阻变化不超过10%
1.Nocasedeformationorchange
inappearance.
2.△L/i10%
3.△Q/Qi30%
4.QCR/DCRi10%
1.无明显的外观缺陷
2.感值变化不超过10%
3.质量因子变化不超过30%
4.直流电阻变化不超过10%
Ughtempei-ilure
Room
Temp
1H
0
A
TestTime
hoursatroomtemperature.
温度:
85±°C,时间:
96±,小时样品在室温
下放置1小时,
不超2小时间必须测试.
Temperature:
-252CTime:
962hours
Testednotlessthan1hour,normorethan2
hoursatroomtemperature.
温度:
-25±C时间:
96±2,小时
样品在室温下放置1小时,不超2小时间必须测试.
1.Dryovenatatemperatureof40
for24hours.
±°°
2.MeasurementsAttheendofthisperiod
3.Exposure:
Temperature:
402C,Humidity:
93±3%RHTime:
96±2hours
4.Testedwhilethespecimensarestillinthe
chamber
5.Testednotlessthan1hour,normore
Temp&Humidity
S3%RH
HLghtfimperarure
HtghhEmiidjiy
0
95HTestTime
than2hoursatroomtemperature.
1.样品必须先在40°±°条件下干燥24小时
2.干燥后测试
3.暴露:
温度:
40±°C,湿度:
933%RH时间
96±2hours
4.暴露结束后,在试验箱中进行测试.
5.样品在室温下放置1小时,不超2小时间必须测试.
First-40CforTtime,next+125CTtimeas1cycle.Gothrough20cycles.
Thermalshocktest
Referencedocuments:
MIL-STD-202GMethod107G
热冲击测试
Solderabilitytest
Referencedocuments:
MIL-STD-202GMethod208H
IPCJ-STD-002B
可焊性测试
1.Nocasedeformationorchangeinappearance.
2.△L/臣10%
3.△Q/Qi30%
4.△DCR/DCR三10%
ForT:
weight三28g:
15Min;28gweight三136g:
30Min
1.无明显的外观缺陷
2.感值变化小于10%
3.
质量因子变化小于30%
4.直流电阻变化小于10%
Terminalsareamusthave
95%min.
Soldercoverage
端子必须有95%以上着锡
HeatenduranceofReflow
soldering
Referencedocuments:
IPCJ-STD-020B
过再流焊测试
Vibrationtest
Referencedocuments:
MIL-STD-202GMethod201A
«Nocasedeformationorchangeinappearance.
*△L/Li10%
«△Q/Q三30%
«△DCR/DCR三10%
*无明显的外观缺陷
*感值变化不超过10%
*质量因不变化不超过30%
*直流电阻变化不超过10%
«RefertothenextpagereflowcurveGothrough3times
*Thepeaktemperature:
2455+
*参照下页回流焊曲线过三次
*峰值温度为:
245±5C
1.Nocasedeformationorchangeinappearance.
2.△L/i10%
3.△Q/Qi30%
4.△DCR/DCRi10%
Applyfrequency10~55Hz.0.75mmamplitudeineachofperpendiculardirectionfor2hours.(total6hours)
振动测试
Droptest
Referencedocuments:
MIL-STD-202GMethod203C
落下试验
Terminalstrengthpushtest
Referencedocuments:
JISC5321:
1997
端子强度试验
1.无明显的外观缺陷
2•感值变化不超过10%
3•质量因子变化不超过30%
4•直流电阻变化不超过10%
1.Nocasedeformationorchangeinappearance.
2.△L/臣10%
3.△Q/Qi30%
4.△DCR/DCR三10%
ForT:
weight三28g:
15Min;28gweight三136g:
30Min
1.无明显的外观缺陷
2.感值变化小于10%
3.质量因子变化小于30%
4.直流电阻变化小于10%
Pullingtest:
DEFINE:
A:
sectionalarea
ofterminal
Ai8(SqM)
force仝5Ntime:
30sec
8(SqM) force仝10Ntime: 10sec
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