日本东京精密.docx
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日本东京精密.docx
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日本东京精密
东京精密株式会社
公司简介
东京精密株式会社是日本著名半导体制造设备之一,公司总部设在日本东京都三鹰市,在美国,欧洲,新加坡,中国等地设有分公司,研发基地或生产厂等.
Wedevelopourbusinessesintwokeyareas:
semiconductormanufacturingequipmentandprecisionmeasuringsystems.Ourphilosophyistogeneratelong-termgrowththroughthecreationof"WIN-WIN,"ormutuallybeneficial,relationships,withallourstakeholders-customers,businesspartners,shareholdersandemployees.(公司网站原文)
东京精密主要从事半导体加工设备及精密测量仪器制造及开发.半导体加工设备有硅片加工用地倒角机、内圆切片机,半导体加工前道工序用的光刻机(LEEPL)、CMP、晶片表面综合检查设备及测试封装用的探针台、划片机、硅片背面抛光机等.
过去,东京精密简称“TSK”,在国内半导体行业享有盛誉。
现在东京精密采用了新的商标“ACCRETECH”,她是由英文成长ACCRETE和技术TECHNOLOGY的合成词,是融合公司”以WIN-WIN精神工作,创世界一流产品“经营理念的新标志。
参展产品:
硅片材料的内圆切片机、硅片倒角机,光刻机,CMP,硅片表面检查系统,探针台背面减薄抛光机,划片机。
网址:
http:
//www.accretech.jp/
SemiconductorManufacturingEquipment:
Productlist
WaferManufacturingSystem
VarietyofproductslineforwafermanufacturersincludingWaferSlicingMachineandWaferEdgeGrindingMachine.
SlicedWaferCarbonDemountingandCleaningMachine:
C-RW-200/300
Feature1
Automaticdemountingofwafersfromtheslicingbase,cleaningandstoringintothecassette.
WaferEdgeGrinding:
W-GM-5200
∙Newly-developedgrindingunitenhancestherotativeprecisionofthespindle,andimprovesthesurfaceroughness.
∙Thenon-contactmeasuringmethodachievesthestablealignment.
∙Performsthenon-contactmeasuringofthepre-processedwaferthicknessatmultiplepoints,thediameterandnotchdepthofthepost-processedwafer.
∙Themodularconcepttomaketheoptimumprocesslinepossible.
∙Lowdamagegrindingmethodisavailable.
Feature1
Machinespecificationreadyfor300mmand200mmwafer.
Feature2
Visualsystem(optional)formeasuringthechamferwidthofperipheryandnotch.
WaferEdgeGrinding:
W-GM-4200
∙Newly-developedgrindingunitenhancestherotativeprecisionofthespindle,andimprovesthesurfaceroughness.
∙Thenon-contactmeasuringmethodachievesthestablealignment.
∙Performsthenon-contactmeasuringofthepre-processedwaferthicknessatmultiplepoints,thediameterandnotchdepthofthepost-processedwafer.
∙Themodularconcepttomaketheoptimumprocesslinepossible.
∙Lowdamagegrindingmethodisavailable.
Feature1
Machinespecificationreadyfor75-150mmwaferorfor150-200mmwafer.
Feature2
Capableofvariousmaterialprocesses,suchaschemicalcompoundsemiconductor.
WaferSlicingMachine:
S-LM-116G
Preciseslicingmachineforfragilematerialssuchasglass,ceramics,ferrite.
Feature1
16"-sizebladeforeasyhandling,liftingandadjustment.
Feature2
Open-structureloadingunitforeasymountingoftheworkpiece.
Feature3
Easysettingofslicingspeedandwaferthicknesswithdigitalswitch.
Feature4
Strongframe,highlyrigidtableprovideslong-termstabilityinperformance.
Feature5
Easycoolantadjustmentanddressingoperation.
WaferSlicingMachine:
A-WS-100S
Scribeswafersubstratewithhighprecision
Feature1Easyalignment
Withfineadjustmentinhorizontalandrotativedirections
Feature2Easyscribesetting
Withthetouchpaneltosettheindexamount,numberoftimesofscribing,etc.
CMP
CMPsremoveunevennessonwafersurfacesthatoccurduringtheproductionprocess.Applicationsaregrowingduetotheincreaseoflayersinsemiconductordevicesandthegrowingvarietyofwiringmaterials.
ChaMP:
For300mmWafers
CombiningthetechnologicalexpertisebuiltupbyAccretechinprecisionmeasuringequipmentandsemiconductormanufacturingequipment,wenowoffer"theChaMPSeries",theCMPsystemscompatiblewith300mmwafers,withprocessperformancerequiredbydesignrulesfor90nmand32nmdevices,andabletokeepupwiththemostadvancedvolume-productionfabs.
Feature1Air-floatHead"Sylphide"
∙Referencepolishingismadepossibleviaanaircushionthatprovidesuniformpressuredistribution.
∙Waferpressureisappliedbyanairbagindependentofringpressure,providingexcellentlow-pressurecontrollabilityandstability.
∙Zonecontrolisavailable.
Feature2EdgeExclusionof1mm!
Feature3WaferPressureControllability&Repeatability
Feature4SimpleMaintenanceforPolishingHeads-RingChange
Demounting(approximately5seconds)
Slidethesnapringcoverupwithbothhands
Spreadthesnapringwithyourthumb(theretainingringdropsoff)
Completelyremovetheretainingring
Mounting(approximately10seconds)
1.Gripthesnapringwithbothhandsandpushtheretainerintothecarrier.Rotateitslightlytoalignthefaceswherethepositioningframeslipsintoplace.
2.Attachthesnapringroundthewholecircumferenceandslidethecoverdown.
ChaMP:
For150or200mmWafers
For150or200mmWafers
ChaMP:
CompactCMPSystem
Smallfootprint
WaferProbingMachines
Waferprobingmachinesperformelectricaltestsofeachchiponawafer,ensuringthequalityofsemiconductordevices.
WaferProbingMachines:
UF3000EX
Next-generationhigh-specprobingmachinetheworldNo.1supplierpresents
Phenomenallevelsofthroughputhavebeenmadepossiblewiththesynergisticeffectsofhigh-speedwaferhandlingenabledbyanewalgorithm,andthehigh-speedandlow-noiseXYStageenabledbyanewlydevelopedpurpose-builtdriveunitforprobes.TheZaxisensuresworld-classloadcapacityandhighprecision,andoffersexcellentcontactviaanoptimalstructuraldesignthatemploystopologywhichreliablyeliminateschangesinflatnessduetopositioning.
WithadvancedOTSlatestpositioningsystemtechnologyandbycolorizingwaferalignmentimagingandequippingalightsupermagnificationfunction,theUF3000EXhasimproveddramaticallyintermsofprecisionandoperability.
WaferProbingMachines:
UF3000EX-e
Assimilatingtheup-to-datetechnologiessuchasoriginativeOTS,QPUandTTG,thissuperhigh-specsystemprovidesthetestingsystemwhichmeetsyourneedsfortheminiaturizationofthenext-generationdevicesandvarioustestingenvironment.
Feature1OTS-thenewestpositioningtechnology(OpticalTargetScope)
OTSenablestomeasuretherelativepositionofthecameraswithabsoluteaccuracy,whichimproveddramatically.
BasedontheACCRETECHmetrologytechnology,OTSenablestheself-correlationofthealignmentopticalsystem.
Feature2QPU-superhigh-rigidchucking(Quad-PodUnit)
Toeffectivelyattaintheaccuracyinpositioning,thehighrigidityofeverypartisgreatlyimportant.
TheUF3000usesthenewtechnologyof4axesdrivingmechanism(QPU)forZ-axis,enablingthehigh-rigid,stableprobecontact.
Feature3Load-port
Testingenvironmentsatisfyingtheusers'needsisavailablebythecommonplatformof8-inchand12-inchcassettesandthefrontallocationoftheinspectiontray.ThemachineisalsoreadyforAMHS(AutomatedMaterialHandlingSystem).
Feature4TTG(TouchToGo)
Pursuingtheeasyoperation,theUF3000adoptsthefunctiontomovetothepositionyoutouchonthemaporimageshownonthetouchpanel.Settingupiseasy,andscreenconfigurationispossiblebytheuserdefinition.
WaferProbingMachine:
UF2000
TokyoSeimitsu,nowknownasAccretech,hascontinuedtoleadthesemiconductorindustryastheworld'snumberonemanufacturerofwaferprobingmachines.ThenewlydevelopedUF2000high-precision200mmwaferproberisdesignedfordeviceswithdecreasingpadpitchestypifiedbyLCDdriversandothersuchdevices,andfeaturesenhancedfunctionalityinallareas,whileofferingthesamefunctionsandoperatingeaseasthepreviousmodel.
Feature1
Achievesoverallprecisionof±1.5µm.
Feature2
Adoptsnewprocessor,newlydesignedloaderandimageprocessingsystemwithenhancedperformance,dramaticallyboostingthroughput.
WaferProbingMachine:
UF200R
EvolvingandProliferatingWaferProbingMachine,UFSeries
Basedonaflexibleplatform,thehighaccuracyandhighrigidity,UFseriesisfurtherevolved.Wafersarevaryingwiththeprogressoflinewidthshrinkageandassemblytechnology.Thismachinecanbeusedforprocessingverythinwafersandcanbeusedasahandlerforthewaferlevelburn-insystem.
Feature1
8-inchmultipurposemachine.
WaferProbingMachine:
UF190R
EvolvingandProliferatingWaferProbingMachine,UFSeries
Basedonaflexibleplatform,thehighaccuracyandhighrigidity,UFseriesisfurtherevolved.Wafersarevaryingwiththeprogressoflinewidthshrinkageandassemblytechnology.Thismachinecanbeusedforprocessingverythinwafersandcanbeusedasahandlerforthewaferlevelburn-insystem.
Feature1
High-performance,high-throughput,andexcellentcostperformancemachine.
Feature2
TheUF190Afeaturesthesamehigh-performanceandexcellentoperabilityastheUF200earnedareputationincludingtheautomaticneedlealignmentfunctionandthecolorLCDtouchpanel.
WaferProbingMachine:
FP200A
EvolvingandProliferatingWaferProbingMachine,UFSeriesBasedonaflexibleplatform,thehighaccuracyandhighrigidity,UFseriesisfurtherevolved.Wafersarevaryingwiththeprogressoflinewidthshrinkageandassemblytechnology.Thismachinecanbeusedforprocessingverythinwafersandcanbeusedasahandlerforthewaferlevelburn-insystem.
Feature1
Frametransferreadyforthethinnerwafer.
WaferProbingMachinesNetwork:
VEGANET
Theoperationstatusofthewaferprobingmachinescanbecentralizedlymonitoredtofurtherimprovetheoperationrate
Systemmonitor
Operationratecontrol
Proberstatusmonitor
Dataanalysis
WaferProbingMachinesNetwork:
LIGHTVEGA
Theresourcecontrolwillbecentralizedontheuserhost
WaferProbingMachinesNetwork:
GEMNetworkSystem
WaferProbingMachinesNetwork:
VEGAPLANET
Dedicatedterminalscontributingtotheefficiencyenhancement
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