情绪管理方法T++EQWord文档格式.docx
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情绪管理方法T++EQWord文档格式.docx
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2.UnclearmeaningonboardThk
3.Lay-uporder
4.Lay-upstructure
IV.Drilllayer&
hole
1.Holetype
2.Mismatchedholechartinformation
3.Specialholewithstrangeconductorpad
4.HoleDiameterTol
5.Pressfithole
6.Overlappedhole
7.Tooclosebetweenholetoboardedge
8.Holequantity
9.HolelocationTol
10.Positionofstamphole
V.Drawing,dimension&
Tolerance
1.Outlinetolerance
2.Mismatcheddimensions
3.Missingdimensions
4.Innercornersize
5.AsymmetryTol
6.Dataofholetoedge
7.Quality&
sideforFiducialmark?
8.DirectiontoarrangeunitinarrayDWG
VI.Impedanceitems
1.Whichkindofline?
2.Impedancevalue
3.Couponlinewidth
4.Distancebetweenholesincoupon
5.Testpointissue
VII.CuThk
1.PTHhole
2.Buriedhole&
blindhole
3.SurfacecopperThk
VIII.Conductordesign
1.Deletenon-functionalisolatedpadsininnerlayer
2.Annularring
3.Clearanceissue
4.Isolatedlinetoseparatedifferentareaininnerlayers
5.Tentingholeissue
6.Linewidth/spacingTol
7.Strangedesign
8.Exposedcopperalongboardedge
9.PlatingGoldfingerguideline
10.Isolatedfiducialmark
11.Dummypatternatbreakawayarea
12.Dummypatternatblankareainboard
13.Fillinthenarrowspacing
14.Similarissueon“MadeinUSA”
15.LOGOposition&
type
IVIII.Soldermask&
Legendfilm&
other(Carbonink&
peelablemask)
1.SoldermaskThk
2.Pluggedholeitems
3.Soldermaskbridge
4.Exposedline/pad
5.SoldermaskbridgebetweenGoldFinger
6.DistancebetweentheS/Mopeningedgeofviahole/padandS/MopeningofthetopofGoldFinger
7.ExtraS/Mopening
8.MissingS/MopeningforSMTpad/roundpad
9.Componentmarkbridge
10.C/Mwidth
11.Reverselegend
12.LOGOincreasecost
IX.Surfacefinal
1.Nocallsurfacetreatment
2.Rohsrequirement
3.TighterThk
4.Feasibilityofprocess
XI.Fabricationforprofile
1.RoutorPunch
2.V-cut
3.G/Fbevel
4.Chamfer
XII.Bow&
Twist
XIII.X-out
CommonQueryForYourReference
I.Documentitems
Question1:
AftercomparingthecustomernetlistfilewithCADfilminputtedbyourCAD/CAM.Someshort/openwasfound.seefigxx.
Suggestion:
a)IngorethenetlistfileandjustfollowtheCADdatatodo.
b)PleaseresendtherightGerberfiletous.
Question2:
Wecan’topenthefileinthepackage(seefigxx).
a)Ingoreit.
b)Pleaseresendittouswithotherformat.
Question3:
MissingfilescalledintheGerberfile(seefigxx).
a)Ingorethem.
b)PleasesendthemtousASAP.
4.Whatthefilesareusedfor?
Question4:
wedon’tknowwhatthefilescalledinpackageusedfor?
(seefigxx).
b)Pleaseadvise.
Question5:
TheRevofcustomerP/NisdifferentbetweenRevAinGerberfileandRevBinmailinformation?
a)FollowRevAinGerberfiletodo.
b)Pleaseadvise.
Question6:
Customerdon'
tcallfabricationspecfortheproject.
a)We’lluseIPC-A-600GClass2&
IPC-6012Class2todo..
Question7:
Customerrequiresprintsoldermaskonbothsides,butthereisTopsidesoldermaskfilmintheGerber..
a)PleaseconfirmtheoneS/Mfilmwillbeappliedtobothsides.
b)JustapplytoTopside.
Customerrequirestousexxxlaminatecore,butwehavenothiskindofmaterialinstore,it’lltakelongtimetoorderthespecialmaterialandincreaseproductioncycle.
Toshortenlead-time,weproposetousexxxlaminatecorefromxxxvendorinsteadofit.
CustomerrequirestousexxxlaminatecorewithhighTg(>
=170degree),butwehavenothiskindofmaterialonhand,it’lltakelongtimetoorderthespecialmaterialandincreasehighcost.
Toreducecostandshortenlead-time,weproposetousexxxlaminatecorewithnormalTg(nominal140degree)fromxxxvendorinsteadofit.
CustomercallFR-4materialforthesingle-sideboard.
Toreducecost,weproposetouseCEM-1/CEM-3insteadofit,pleaseconfirm.
3.Soldermaskinkmaterial
XXXsoldermaskinkisrequiredincustomerDWG,butwehavenothematerialinstock,andit’lltakelongtimetoorderitandincreasehighcost?
a)Toreducecostandshortenlead-time,weproposetouseGreenxxxinkfromxxxvendorinsteadofit..
4.Otherspecialmaterial
.Forotherspecialmaterial,refertoaboveEQtoinquirecustomertousecommoncheapmaterialinsteadofit.
1.NospecifiedBoardThk
NotspecifiedboardThk&
TolincustomerDWG&
Spec..
a)We’llbuildthefinishedboardThk&
tolas1.6+/-0.16mm..
Thetoleranceofboardthk+/-xxxmiliscalledincustomerDWG/Spec,butit’sverytight.Ifmeetit,wehavetoorderspecialmaterialandincreasehighcost.
a)Toreducecost,pleasekindlyrelaxitto+/-10%ofboardThk.
b)Ifcustomerinsistonit,pleaseMKTreconsiderthecost.
2.UnclearmeaningonboardThk
Wecan’tknowwhethertheboardThicknessxxxmilcalledbycustomerisfinishedorexcludingsoldermask?
.
a)BoardThkXxxmilmeanstotalfinishedboardthk..
b)ItjustmeansThkbeforeplating(orsuggestexcludingsoldermask).
Customerdoesn’tdefinethelay-uporder.
a)We’llbuildboardpertheorderofArt1/Art2/Art3/Art4.
4.Lay-upstructure
Basedoncustomerlay-upstructure,finishedboardThkwillbeaaamil,butbbbmilisrequiredinDWG/spec,wecan’tmeetthematthesametime.
a)Followcustomerlay-uptodo,butfinishedboardThkwillbeaaamil.
b)BuildfinishedboardThkbbbmil,butallowustoadjustlay-upasshowninattachedfigxx.
Question1:
Customerdoesn’tdefinetheholetype(PTHorNPTH).
a)We’llbuildholes’typeasoursuggestedinFigxx.
MismatchedholesizebetweenDiaxxxmilincustomerholechartandDiaxxxmilincustomerDWG(seefigxx&
xx).
a)Followcustomerholecharttodo.
b)FollowdatamarkedincustomerDWGtodo.
Incustomerholechart,theDiaxxxmilholeisPTHhole,butthereisnoconductorpadatthecorrespondingposition(seefigxx)
a)Justfollowholechart&
CADtodoitPTHwithoutannularring..
b)DoitasNPTHhole.
4.HoleDiameterTol
Notspecifiedthetoleranceofholediameter/slotincustomerspecandDWG.
a)We’llbuildthemasbelow:
ForViaholes(lessthanDia18mil):
+3/-8mil;
ForPTH(exceptVia):
+/-3mil;
ForNPTH:
+/-2mil.
Forslotwidth+/-3mil,slotlength+/-4mil.
5.Pressfithole
CustomerrequiresPressfitholefinishedDiaxxx+/-xxxmilanddrillbitsizeDiaxxx+/-xxxmil,butduetotheunevenconductordesign,andgenerallyweneedtocompensateaboutxxxmilforHALsurfacefinal(seefigxx),sowecan’tmeetthematthesametime.
a)Justcontrolfinishedholediameter&
tol,andignoretherequirementofdrillbitsize&
Tol.
b)Ifcustomerinsistonit,wehavetoorderspecialdrillbit,pleasereconsidercost(Onlyundertheconditionthatcustomerstronglyrequireitandit’sfeasible,usuallywedon’traisethesuggestion).
6.Overlappedhole
Question6:
DiaxxxmilholeisoverlappedwithanothersmallDiaxxxmilhole.
a)We’lldeletethesmallhole.
<
ifthesamesizeholeoverlapped,don’traiseit,deleteitdirectly>
ifseveralPTHhole’centerisveryclose,doitPTHslotdirectly>
ifPTHholesoverlapped,butthecenterbetweenadjacenttwoholesisbigger,tosmoothproduction,raiseEQtochangeitasslot>
7.Tooclosebetweenholetoboardedge
Question7:
Thedistancefromholeedgetoboardedgeisveryclose(onlyxxxmil).
a)FollowCADtodo,butafterbuildingprofile,theholewillbroken.
b)We’llmovetheholetowardunitaboutxxxmiltoavoidbroken.
(orproposetochangeholesize;
iftheholeisPTH,needtoconsiderannularring)
8.Holequantity
Question8:
MismatchedholequalitybetweenxxxincustomerholechartandxxxinCADdrilllayer(seefigxx).
FollowCADdrilllayertodo.
9.HolelocationTol
Question9:
Thepositiontolerance+/-xxxmilofholepositionisrequiredincustomerDWG,butduetoregristrationdeviationduringdrilling&
D/Fprocess,it’sverytight.(seefigxx).
Tosmoothproduction,pleasekindlyrelaxitto+/-xxxmil.
<
ifchangepnl/stackduringdrillingprocess,thereasontoraiseEQiscost>
10.Positionofstamphole
Question10:
Accordingtocustomerdesignstampholes,it’sveryclosetoconductorpattern,it’llcauseexposedGNDcopper/line(seefigxx).
a)We’llshaveGNDcopperaboutxxxmil/movelineaboutxxxmiltoavo
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